JPS6112700Y2 - - Google Patents
Info
- Publication number
- JPS6112700Y2 JPS6112700Y2 JP17483979U JP17483979U JPS6112700Y2 JP S6112700 Y2 JPS6112700 Y2 JP S6112700Y2 JP 17483979 U JP17483979 U JP 17483979U JP 17483979 U JP17483979 U JP 17483979U JP S6112700 Y2 JPS6112700 Y2 JP S6112700Y2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- resin
- hybrid
- silicone resin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims 2
- 229920002050 silicone resin Polymers 0.000 description 11
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17483979U JPS6112700Y2 (en]) | 1979-12-19 | 1979-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17483979U JPS6112700Y2 (en]) | 1979-12-19 | 1979-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694044U JPS5694044U (en]) | 1981-07-25 |
| JPS6112700Y2 true JPS6112700Y2 (en]) | 1986-04-19 |
Family
ID=29685553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17483979U Expired JPS6112700Y2 (en]) | 1979-12-19 | 1979-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112700Y2 (en]) |
-
1979
- 1979-12-19 JP JP17483979U patent/JPS6112700Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5694044U (en]) | 1981-07-25 |
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